This book describes most recent advances and limitations concerning design of adhesive joints under humid conditions and discusses future trends. It presents new approaches to predict the failure load after exposure to load, temperature and humidity over a long period of time. With the rapid increase in numerical computing power there have been attempts to formalize the different environmental contributions in order to provide a procedure to predict assembly durability, based on an initial identification of diffusion coefficients and mechanical parameters for both the adhesive and the interface. A coupled numerical model for the joint of interest is then constructed and this allows local water content to be defined and resulting changes in adhesive and interface properties to be predicted.
Explore Design of Adhesive Joints Under Humid Conditions by Lucas F. M. da Silva & Chiaki Sato on eBooksStore by Arnlweb. Discover book details, reader ratings, reviews, release information, genres, and related digital books available through the iTunes Store.
This book is part of our growing collection of bestselling eBooks, popular digital reading materials, and trending author releases. Readers can explore similar books, discover new authors, and browse related genres including fiction, romance, mystery, fantasy, business, self-help, educational books, and more.
Our platform helps readers discover highly rated digital books optimized for smartphones, tablets, laptops, and desktop devices. Browse fast-loading book pages, reader reviews, and popular recommendations from bestselling authors worldwide.